[institut] Predavanje Prof. Thomas Zwick, Karlsruhe Institute of Technology, Germany

[Branka Jokanovic]

Postovane kolege,

imam izuzetno zadovoljstvo da vas pozivam na predavanje koje ce odrzati 
Prof. Thomas Zwick, IEEE Fellow, Director of the Institute of Radio 
Frequency Engineering and Electronics (IHE) at the Karlsruhe Institute 
of Technology (KIT), Germany, pod nazivom:


ANTENNA INTEGRATION IN MILLIMETER-WAVE TRANSCEIVERS FOR HIGH VOLUME 
APPLICATIONS


26. novembra 2018. godine u citaonici Instituta za fiziku "Dr Dragan 
Popovic" sa pocetkom u 12h.

Prof. Zwick ce sa svojim PhD studentima boraviti u Institutu u okviru 
saradnje sa Laboratorijom za metamaterijale, Centra za fotoniku na 
bilateralnom projektu: "Advanced Multi-Beam and Scanning Antennas for 5G 
and Radar Applications(5G-MultiScan)".

APSTRAKT PREDAVANJA

The enormous technological progress accomplished over the last decades 
facilitates the utilization of millimeter-wave (mmw) frequencies for 
mass products like automotive radars, industrial sensors, high-speed 
data communication links or medical applications. The main enablers are 
the semiconductor technologies with constantly improving cut-off 
frequencies reaching several hundred GHz. The dominant limiting factor 
though for the mass production of low-cost mmw systems above 100 GHz is 
that, suitable packaging technologies are not yet finally available. The 
major issue for the packaging is to find a proper way to get all signals 
in and out of the package, since at mmw frequencies interconnects are 
very difficult to realize and very lossy. One way out of the dilemma is 
to integrate the complete transceiver together with the antenna into one 
single package. Compactness is the key to low losses in mmw 
interconnects. This also means that the antenna must be integrated into 
the package.
In this talk, a short overview on the packaging and antenna integration 
concepts for mmw transceivers is provided together with several 
particular approaches. The different challenges for antenna integration 
and interconnects can be found in [1, 2, 3, 4, 5, 6]. In the second 
part, complete solutions are shown where in one case the mmw frontend is 
integrated together with off-chip antennas in a molded 8 mm by 8 mm QFN 
package [7] and in another case an on-chip antenna together with a lens 
is mounted in an 8 mm by 8 mm QFN package as well [8]. An application 
example of a complete radar system with the packaged transceiver 
soldered on a baseband PCB with microprocessor and lens above the chip 
to yield a narrow beam is shown. The complete module has a size of 35 mm 
x 35 mm x 25 mm and allows distance measurements with a high accuracy 
[9]. An outlook on packages for high data rate transmission conclude the 
talk [10].

REFERENCES

[1]	T. Zwick, S. Beer, "QFN based Packaging Concepts for Millimeter-Wave 
Transceivers," IEEE International Workshop on Antenna Technology (iWAT), 
Mar. 2012.
[2]	S. Beer, H. Gulan, M. Pauli, C. Rusch, G. Kunkel, T. Zwick, "122-GHz 
Chip-to-Antenna Wire Bond Interconnect with High Repeatability", in IEEE 
Microwave Symposium Digest (MTT), 2012.
[3]	S. Beer, C. Rusch, H. Gulan, B. Göttel, M.G. Girma, J. Hasch, W. 
Winkler, W. Debski, T. Zwick, "An Integrated 122-GHz Antenna Array with 
Wire Bond Compensation for SMT Radar Sensors," IEEE Transactions on 
Antennas and Propagation, vol. 61, no. 12, Dec. 2013, pp. 5976-5983.
[4]	S. Beer, C. Rusch, B. Goettel, H. Gulan, M. Zwyssig, G. Kunkel, T. 
Zwick, "A Self-Compensating 130-GHz Wire Bond Interconnect with 13% 
Bandwidth," IEEE Antennas and Propagation Society International 
Symposium, July 2013.
[5]	S. Beer, H. Gulan, C. Rusch, T. Zwick, "Coplanar 122-GHz Antenna 
Array with Air Cavity Reflector for Integration in Plastic Packages", 
IEEE Antennas and Wireless Propagation Letters, vol. 11, Jan. 2012, pp. 
160-163.
[6]	B. Goettel, P. Pahl, C. Kutschker, S. Malz, U. Pfeiffer, T. Zwick, 
"Active Multiple Feed On-Chip Antennas With Efficient In-Antenna Power 
Combining Operating at 200–320 GHz", IEEE Transactions on Antennas and 
Propagation, vol. 65, no. 2, Feb. 2017.
[7]	T. Zwick, F. Boes, A. Bhutani, B. Goettl, M. Pauli, "Pea-Sized mmW 
Transceivers", IEEE Microwave Magazine, Sept. 2017, pp. 79-89.
[8]	B. Goettel, W. Winkler, A. Bhutani, F. Boes, M. Pauli, T. Zwick, 
"Packaging Solution for a Millimeter-Wave System-on-Chip Radar", IEEE 
Transactions on Components, Packaging and Manufacturing Technology, vol. 
8, no. 1, Jan 2018, pp. 73-81.
[9]	M. Pauli, B. Göttel, S. Scherr, A. Bhutani, S. Ayhan, W. Winkler, T. 
Zwick, "Miniaturized Millimeter-Wave Radar Sensor for High Accuracy 
Applications", invited paper, IEEE Transactions on Microwave Theory and 
Techniques, vol. 65, no. 5, May 2017.
[10]	J. Eisenbeis, F. Boes, B. Goettel, S. Malz, U. Pfeiffer, T. Zwick, 
"30 Gbps Wireless Data Transmission with Fully Integrated 240 GHz 
Silicon Based Transmitter", IEEE 17th Topical Meeting on Silicon 
Monolithic Integrated Circuits in RF Systems (SiRF), 2017, pp. 33-36.


Srdacan pozdrav,

Branka Jokanovic

-- 
Dr Branka Jokanovic, Research Professor
Institute of Physics Belgrade
Pregrevica 118, 11080 Belgrade, Serbia
http://www.ipb.ac.rs/
http://www.metagroup.ipb.ac.rs
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